Hello Friends,
Backdrilling is quite common on high performance VIA transitions in the serial links. Tutorial 10 in the HSD tutorial video series discusses about how to perform Backdrilling on the imported board layout file and perform FEM simulations in ADS.
Happy Designing….!!!
Hello Friends,
Tutorial 9 in the HSD Tutorial series discusses about how to perform Full 3D FEM simulation on the post layout VIA transition for accurate performance analysis of High Speed Serial Links.
Enjoy the tutorial and don’t forget to leave your valuable comments on my You Tube channel or on this blog page. Also, request you to mention the topics on which you would like to see the videos and I shall try to create and post those to help your cause.
Happy Designing….!!!
I would be conducting a day-long, hands-on workshop on High Speed Signal Integrity design at Keysight Technologies, Bangalore office. First session is scheduled on 17th August 2017.
This workshop is complimentary but requires prior registration to receive a formal invite.
Workshop Agenda:
Pre Layout SI
Post Layout SI
If you are interested to attend the same, you can drop a mail with your complete contact details at “anurag_bhargava@keysight.com” or leave your details in the comment box….
Happy Designing…!!!
P.S. If we are not able to accommodate you for the 1st session due to capacity limit or you are not able to make it due to other engagements then we will surely accommodate you in one the future sessions which are likely to happen shortly.
Creating multilayer layouts can be lot of pain at times essentially because of transitions between layers.
With ADS2011 release onwards, ADS provides an easy way for designers to create their own automatic via insertion config file which can be created and used by designers even if they do not get this support from foundry or PCB fab people.
Using this feature, designers can route their layouts lot easier and VIAs will keep coming whenever layers are changed for routing purposes.
You can watch this simple video to learn more about this nice feature:
Happy Designing….
Anurag
Simulating accurate VIA performance is one of the key to perform good multilayer board design for RF/uWave as well as High Speed Digital applications to maintain Signal Integrity.
Over the years designers tend to believe that only full 3D simulators i.e. FEM or FDTD based solvers can offer accurate simulations for multilayer VIA structures and complex 3D simulations are performed which can take up to several hours to simulate VIA structures causing increased turn around and design iterations.
With newer ADS releases it is now possible to simulate multilayer VIA structures accurately and efficiently using Method of Moments (MoM) i.e. ADS Momentum largely due newer algorithms which are incorporated in ADS to handle such geometries very accurately.
Also newer ADS release comes with a very nice utility to draw these multilayer VIAs pretty quickly and efficiently. Attached technical note offers step by step procedure to use the multilayer VIA utility to draw these kind of VIA structures and discusses simulation of multilayer VIA using Momentum & FEM solver which are fully integrated into ADS environment. Comparison of results using Momentum & FEM solvers are also provided.
Happy Designing…..
Anurag
RF/Microwave Circuit & System Blog 