Practical Modeling of High Speed Channels Based on Datasheet Input

As Dave Dunham from Molex Corp. likes to say “When designing high speed serial links beyond 10 GB/s, everything matters“.  Part of that everything is accurate modeling of transmission line losses. It is important to model dielectric and conductor loss accurately.

Here is a very useful presentation with speaker notes on the topic of “Practical Modeling of High Speed Channels Based on Datasheet Input” presented by Bert Simonovich, Lamsim Enterprise Inc at EDICON 2017.

Here is the motivation of the methodology proposed:

As my friend Eric Bogatin often likes to say, Sometimes an OK answer NOW! is better than a good answer late.” As a high-speed signal integrity practitioner and backplane architect, I often have to come up with an answer sooner, rather than later because of the impact to time and cost to my clients. And that’s why I have been motivated over the last few years to research and develop a simple methodology to accurately determine parameters to feed into modern EDA tools .

Happy Designing…..!!!

Anurag Bhargava




Workshop on High Speed Signal Integrity

I would be conducting a day-long, hands-on workshop on High Speed Signal Integrity design at Keysight Technologies, Bangalore office. First session is scheduled on 17th August 2017.

This workshop is complimentary but requires prior registration to receive a formal invite.

Workshop Agenda:

Pre Layout SI

  • Designing VIAs for optimum High Speed performance
  • Controlled Impedance Line Design
  • Channel Simulation Basics
  • High Speed Serial Link Simulation
  • Batch Simulation
  • IBIS-AMI Simulation
  • Eye Optimization

Post Layout SI

  • BRD/ODB++ Layout Import in ADS
  • Post Layout SI Simulation with SIPro
  • Channel Simulation with Post Layout Data

If you are interested to attend the same, you can drop a mail with your complete contact details at “” or leave your details in the comment box….

Happy Designing…!!!

P.S. If we are not able to accommodate you for the 1st session due to capacity limit or you are not able to make it due to other engagements then we will surely accommodate you in one the future  sessions which are likely to happen shortly.

Webinar Recording Available: Solve your SI & PI challenges using Keysight EEsof EDA Tools

Video recording of my webinar on “Solving your SI & PI challenges” scheduled on 6th April 2017 is now available at my YouTube channel now. Look forward for your comments & suggestions……

You can view the recording here:

For more information:


Eye Diagram Optimization

Eye Diagram analysis is one of the most commonly used analysis during Pre or Post Layout Signal Integrity simulations.

This short tutorial video explains simple to use steps of performing optimization of key Eye diagram parameters such as Eye Height giving lot of freedom to High Speed designers to tweak their designs.

Also, use of marker slider is explained which can significantly simplify the job of plotting eye diagram for each swept variable after we perform Parameter Sweep or Batch simulation on our pre- or post- layout board designs.

Don’t forget to like or leave a comment after watching the video…

Happy Designing…..

Multilayer VIA simulation using ADS (Momentum & FEM)

Simulating accurate VIA performance is one of the key to perform good multilayer board design for RF/uWave as well as High Speed Digital applications to maintain Signal Integrity.

Over the years designers tend to believe that only full 3D simulators i.e. FEM or FDTD based solvers can offer accurate simulations for multilayer VIA structures and complex 3D simulations are performed which can take up to several hours to simulate VIA structures causing increased turn around and design iterations.

With newer ADS releases it is now possible to simulate multilayer VIA structures accurately and efficiently using Method of Moments (MoM) i.e. ADS Momentum largely due newer algorithms which are incorporated in ADS to handle such geometries very accurately.

Also newer ADS release comes with a very nice utility to draw these multilayer VIAs pretty quickly and efficiently. Attached technical note offers step by step procedure to use the multilayer VIA utility to draw these kind of VIA structures and discusses simulation of multilayer VIA using Momentum & FEM solver which are fully integrated into ADS environment. Comparison of results using Momentum & FEM solvers are also provided.

Happy Designing…..


VIA Simulations using ADS.pdf